TY  - BOOK
AU  - Jawitz,Martin W.
TI  - Printed board materials handbook / 
T2  - Electronic packaging and interconnection series   
SN  - 0070324883   
PY  - 1997///
CY  - New york
PB  - McGraw-Hill, 
KW  - Printed circuit
KW  - design construction
KW  - Handbooks, manuals,etc.
KW  - materials
N1  - Includes bibliographical references and index
ER  -